Fig. 4.2 Nitronic 30 metallography (a) Annealed; (b) Annealed 750 C 8 h (parallel); (c) Annealed 750 C 8 h (perpendicular) and (d) 25 %Cold Work (CW) (Parallel) Fig. 4.3 Nitronic 30 metallography (a) 25 % CW—Annealed—750 C-8 h (Perpendicular); (b) 25 % CW—Annealed—750 C-8 h (Parallel); (c) 25 % CW (Perpendicular) and (d) 25 % CW (Parallel) 24 C.G. Fountzoulas et al.
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