reducing the driving force for crack initiation and even providing a protective residual compressive field at these locations that may retard crack growth. Further study in this area is required to understand the effects of nonisothermal conditions on bond strength, failure modes of the wafer pair, and to develop models to improve the predictive capability of the resulting wafer curvature based on additional stress generation mechanisms. ACKNOWLEDGEMENTS This material is based on work supported by the National Science Foundation under grant # CMS-0700704. REFERENCES 1. Knowles, K. M., van Helvoort, A. T. J. Anodic Bonding. Institute of Materials, Minerals and Mining, 51 (5), 273-311, 2006. 2. Henmi, H., Shoil, S., Shoil, Y., et. al. Vacuum Packaging for Microsensors by Glass-Silicon Anodic Bonding. Sensors and Actuators A, 43, 243-248, 1994. 3. Barth, P., Pourahmadi, F., Mayer, R., Poydock, J., Petersen, K. A Monolithic Silicon Accelerometer with Integral Air Camping and Over-range Protection. Technology Digest IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, SC, 35, 1988. 4. Schmidt, M. Wafer-to-wafer Bonding for microstructure Formation. Proceedings of the IEEE, 86 (8), 15751585, Aug. 1998. 5. Rogers, T. Considerations of Anodic Bonding for Capacitative Type Silicon/Glass Sensor Fabrication. Journal of Micromechanics and Microengineering, 2 (3), 164-166, 1992. 6. Rogers, T., Kowal, J. Selection of Glass, Anodic Bonding Conditions and Material Compatibility for SiliconGlass Capacitive Sensors. Sensors and Actuators: Physical A, 46 (1-3), 113, 120, 1995. 7. Harz, M., Engelke, H. Curvature Changing or Flattening of Anodically Bonded Silicon and Borosilicate Glass. Sensors and Actuators, A: Physical, 55 (2-3), 201-209, 1996. 8. Harz, M., Bruckner, W. Stress Reduction in Anodically Bonded Silicon and Borosilicate Glass by Thermal Treatment. Journal of the Electrochemical Society, 143 (4), 1409-1414, 1996. 9. Cozma, A., Puers, B. Characterization of the Electrostatic Bonding of Silicon and Pyrex Glass. Journal of Micromechanics and Microengineering, 5 (2), 98-102, 1995. 10. Rogers, T., Aitken, N., Stribley, K., Boyd, J. Improvements in MEMS Gyroscope Production as a Result of Using In Situ, Aligned, Current-Limited Anodic Bonding. Sensors and Actuators, A: Physical, 123-124, 106110, 2005. 11. Madou, M. J., June (2005), Fundamentals of Microfabrication: the Science of Miniaturization, CRC Press, Boca Raton. 12. Kern, W. The Evolution of Silicon Wafer Cleaning Technology. Journal of the Electrochemical Society. 137 (6), 1887-1892, June 1990. 13. Horn, G., Lesniak, J., Mackin, T., Boyce, B. Infrared Grey-Field Polariscope: A Tool for Rapid Stress Analysis in Microelectronic Materials and Devices. Review of Scientific Instruments, 76, (045180)-1-10, 2005. 273
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