MEMS and Nanotechnology, Volume 2

11 Oh C-S, Coles G, Sharpe Jr WN, “High temperature behavior of polysilicon,” Materials Research Society Symposium – Proceedings, 741, 53-58, 2002. 12 Oh C-S, Sharpe Jr. WN, “Techniques for measuring thermal expansion and creep of polysilicon,” Sensors and Actuators, A: Physical, 112 (1), 66-73, 2004. 13 Zupan M, Hayden MJ, Boehlert CJ, Hemker KJ, “Development of high-temperature microsample testing,” Experimental Mechanics, 41 (3), 242-247, 2001. 14 Zupan M, Hemker KJ, “High temperature microsample tensile testing of γ-TiAl,” Materials Science and Engineering A, 319-321, 810-814, 2001. 15 Haque MA, Saif MTA, “Thermo-mechanical properties of nano-scale freestanding aluminum films,” Thin Solid Films, 484 (1-2), 364-368, 2005. 16 Kalkman AJ, Verbruggen AH, Janssen GCAM, “High-temperature bulge-test setup for mechanical testing of free-standing thin films,” Review of Scientific Instruments, 74 (3 I), 1383-1385, 2003. 17 Teh KS, Lin L, “Time-dependent buckling phenomena of polysilicon micro beams,” Microelectronics Journal, 30 (11), 1169-1172, 1999. 18 Brotzen FR, Rosenmayer CT, Cofer CG, Gale RJ, “Creep of thin metallic films,” Vacuum, 41(4-6), 12871290, 1990. 19 Hyun S, Brown WL, Vinci RP, “Thickness and temperature dependence of stress relaxation in nanoscale aluminum films,” Applied Physics Letters, 83 (21), 4411-4413, 2003. 20 Mönig R, Keller RR, Volkert CA, “Thermal fatigue testing of thin metal films,” Review of Scientific Instruments, 75 (11), 4997-5004, 2004. 21 Chasiotis I., Cho SW, Jonnalagadda KN, “Fracture toughness and subcritical crack growth in polycrystalline silicon,” J App. Mechanics Trans. ASME, 73 (5), 714-722, 2006. 22 Sutton MA, Li N, Joy DC, Reynolds AP, Li X, “Scanning electron microscopy for quantitative small and large deformation measurements Part I: SEM imaging at magnifications from 200 to 10,000,” Experimental Mechanics, 47 (6), 775-787, 2007. 23 Sutton MA, Li N, Joy DC, Reynolds AP, Li X, “Scanning electron microscopy for quantitative small and large deformation measurements Part II: SEM imaging at magnifications from 200 to 10,000,” Experimental Mechanics, 47 (6), 789-804, 2007. 24 Karanjgaokar N, Jonnalagadda K, Chasiotis I, Chee J, Mahmood A, Peroulis D, “Mechanical behavior of nanocrystalline Au films as a function of strain rate and film thickness,” SEM-11th International Congress and Exhibition on Experimental and Applied Mechanics, 4, 1860-1866, 2008. 180

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