78 D. Yavas et al. 4. Wetzel, M., Holtmannspötter, J., Gudladt, H.-J., Czarnecki, J.V.: Sensitivity of double cantilever beam test to surface contamination and surface pretreatment. Int. J. Adhes. Adhes. 46, 114–121 (2013) 5. Paulauskas, F.L., Meek, T.T., David Warren, C.: Adhesive bonding via exposure to microwave radiation and resulting mechanical evaluation. In: MRS Proceedings, vol. 430, p. 193. Cambridge University Press, New York (1996) 6. Anderson, G.L.: Continuum and fracture mechanical studies of contaminated bonding surfaces. J. Adhes. 41(1–4), 129–137 (1993) 7. Davis, G.D.: Contamination of surfaces: origin, detection and effect on adhesion. Surf. Interface Anal. 20(5), 368 (1993) 8. Olsson-Jacques, C.L., Wilson, A.R., Rider, A.N., Arnott, D.R.: Effect of contaminant on the durability of epoxy adhesive bonds with alclad 2024 aluminium alloy adherends. Surf. Interface Anal. 24(9), 569–577 (1996) 9. ASTM D5528-13: Standard Test Method for Mode I Interlaminar Fracture Toughness of Unidirectional Fiber-Reinforced Polymer Matrix Composites. ASTM International, West Conshohocken (2013) 10. ASTM D7905/D7905M-14: Standard Test Method for Determination of the Mode II Interlaminar Fracture Toughness of Unidirectional FiberReinforced Polymer Matrix Composites. ASTM International, West Conshohocken (2014) 11. Yavas, D., Bastawros, A.F.: Prediction of interfacial surface energy and effective fracture energy from contaminant concentration in polymerbased interfaces. ASME. J. Appl. Mech. 84(4), 044501 (2017) 12. Yavas, D., Shang, X., Hong, W., Bastawros, A.F.: Utilization of nanoindentation to examine bond line integrity in adhesively bonded composite structures. Int. J. Fract. 204(1), 101–112 (2017) 13. Yavas, D., Bastawros, A.F.: Measurement of bond line fracture toughness in adhesively bonded composite structures by nanoindentation. In: Zehnder, A., et al. (eds.) Fracture, Fatigue, Failure and Damage Evolution Conference Proceedings of the Society for Experimental Mechanics Series, vol. 8. Springer, Cham (2017)
RkJQdWJsaXNoZXIy MTMzNzEzMQ==