11 Characterization of Interface Debonding Behavior Utilizing an Embedded Digital Image Correlation Scheme 87 Fig. 11.5 A series of images and calculated ε1 strain through the tensile loading test up to and past the point of a forced delamination event achieved via DIC Fig. 11.6 Calculated strain field near the embedded particle in the –yy direction one frame before and one frame after the debonding event. The location of the maximum local tensile strain is highlighted However, using the available strain information from the DIC analysis results, the maximum local tensile strain in the direction of the applied load was used as a metric to quantify adhesion between the particle and binder material. Due to the geometry of the loading condition, the observed debonding processes is most heavily dominated by the forces in the pure tensile direction at the interface, which corresponds to the strain in the –yy direction obtained from the analysis. It was noted that the maximum local strain value was taken on the side of the particle which leads to the initial debond, as debonding can occur on either side (top or bottom) of the particle in the direction of the applied load. This location of maximum strain taken at the frame before the observed debonding event is highlighted in Fig. 11.6. A collection of results for a significant number of debonding events can be aggregated for a specific particle and binder material to represent an effective distribution of adhesion properties which govern the debonding process between the two materials. This technique could thereby be used to more accurately describe the process of multiple debonding processes occurring within a bulk particulate composite sample. This technique also provides an additional method to characterize
RkJQdWJsaXNoZXIy MTMzNzEzMQ==